RCL3

Features

Substrate: Alumina
Resistive Material: Thin Film
Contact: Gold Plated Half Hard Beryllium Copper
Housing: Nickel Plated Copper

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PLG_SELLACIOUS_CONFIGURATOR_CONFIGURED_PART_NUMBER_LABEL

PLG_SELLACIOUS_CONFIGURATOR_CONFIGURED_PART_NUMBER_DESC

About ElectroTechnik

Electrotechnik is the parent company for multiple passive electronic component companies organized into three primary business units including; capacitive/resistive products, microwave/RF products, and magnetics/transformer products.

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Listing of all Electro Technik companies with their complete contact details.

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METALIZED PLASTIC
Bathtub • 200~600 VDC • 0.5 ~ 30 uF	Metal Tubular • 150~600 VDC • 0.01 ~ 12 uF	Metal Rectangular • 350~50,000 VDC • 0.005 ~ 50 uF	Phenolic Tubular • 1~120 kVDC • 0.0005 ~ 4 uF	Wrap & Fill (Round) • 50~15,000 VDC • 0.001 ~ 50 uF	Wrap & Fill (Flat) • 50~600 VDC • 0.5 ~ 30 uF	Phenolic Rectangular • 30~200 kVDC • 0.001 ~ 50 uF	Glass Tubular • 2~60 kVDC • 0.0001 ~ 0.5 uF

METALIZED PLASTIC (Continued)				PAPER & FOIL
Pulse Forming • 1~25 kVDC Charge • 0.1 ~ 5 uF	Power Packs • 118~240 Vin • up to 100kVDC Out			Metal Tubular • 100~1,000 VDC • 0.001 ~ 1 uF	Metal Rectangular • 600~10,000 VDC • 0.1 ~ 10 uF	Phenolic Tubular • 3~120 kVDC • 0.001 ~ 2 uF	Glass Tubular • 1~15 kVDC • 0.0005 ~ 0.5 uF

METALIZED PLASTIC
Bathtub • 200~600 VDC • 0.5 ~ 30 uF	Metal Tubular • 150~600 VDC • 0.01 ~ 12 uF	Metal Rectangular • 350~50,000 VDC • 0.005 ~ 50 uF	Phenolic Tubular • 1~120 kVDC • 0.0005 ~ 4 uF	Wrap & Fill (Round) • 50~15,000 VDC • 0.001 ~ 50 uF	Wrap & Fill (Flat) • 50~600 VDC • 0.5 ~ 30 uF	Phenolic Rectangular • 30~200 kVDC • 0.001 ~ 50 uF	Glass Tubular • 2~60 kVDC • 0.0001 ~ 0.5 uF

METALIZED PLASTIC (Continued)				PAPER & FOIL
Pulse Forming • 1~25 kVDC Charge • 0.1 ~ 5 uF	Power Packs • 118~240 Vin • up to 100kVDC Out			Metal Tubular • 100~1,000 VDC • 0.001 ~ 1 uF	Metal Rectangular • 600~10,000 VDC • 0.1 ~ 10 uF	Phenolic Tubular • 3~120 kVDC • 0.001 ~ 2 uF	Glass Tubular • 1~15 kVDC • 0.0005 ~ 0.5 uF

RCL3

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