CSI-0200

Specifications
Primary Current (max)	20
Secondary Turns	200
Frequency (GHz)	>20KHz
Diameter	0.17
Min. Secondary Inductance (mH)	80
Description	Tombstone PCB Mount

About ElectroTechnik

Electrotechnik is the parent company for multiple passive electronic component companies organized into three primary business units including; capacitive/resistive products, microwave/RF products, and magnetics/transformer products.

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METALIZED PLASTIC
Bathtub • 200~600 VDC • 0.5 ~ 30 uF	Metal Tubular • 150~600 VDC • 0.01 ~ 12 uF	Metal Rectangular • 350~50,000 VDC • 0.005 ~ 50 uF	Phenolic Tubular • 1~120 kVDC • 0.0005 ~ 4 uF	Wrap & Fill (Round) • 50~15,000 VDC • 0.001 ~ 50 uF	Wrap & Fill (Flat) • 50~600 VDC • 0.5 ~ 30 uF	Phenolic Rectangular • 30~200 kVDC • 0.001 ~ 50 uF	Glass Tubular • 2~60 kVDC • 0.0001 ~ 0.5 uF

METALIZED PLASTIC (Continued)				PAPER & FOIL
Pulse Forming • 1~25 kVDC Charge • 0.1 ~ 5 uF	Power Packs • 118~240 Vin • up to 100kVDC Out			Metal Tubular • 100~1,000 VDC • 0.001 ~ 1 uF	Metal Rectangular • 600~10,000 VDC • 0.1 ~ 10 uF	Phenolic Tubular • 3~120 kVDC • 0.001 ~ 2 uF	Glass Tubular • 1~15 kVDC • 0.0005 ~ 0.5 uF

METALIZED PLASTIC
Bathtub • 200~600 VDC • 0.5 ~ 30 uF	Metal Tubular • 150~600 VDC • 0.01 ~ 12 uF	Metal Rectangular • 350~50,000 VDC • 0.005 ~ 50 uF	Phenolic Tubular • 1~120 kVDC • 0.0005 ~ 4 uF	Wrap & Fill (Round) • 50~15,000 VDC • 0.001 ~ 50 uF	Wrap & Fill (Flat) • 50~600 VDC • 0.5 ~ 30 uF	Phenolic Rectangular • 30~200 kVDC • 0.001 ~ 50 uF	Glass Tubular • 2~60 kVDC • 0.0001 ~ 0.5 uF

METALIZED PLASTIC (Continued)				PAPER & FOIL
Pulse Forming • 1~25 kVDC Charge • 0.1 ~ 5 uF	Power Packs • 118~240 Vin • up to 100kVDC Out			Metal Tubular • 100~1,000 VDC • 0.001 ~ 1 uF	Metal Rectangular • 600~10,000 VDC • 0.1 ~ 10 uF	Phenolic Tubular • 3~120 kVDC • 0.001 ~ 2 uF	Glass Tubular • 1~15 kVDC • 0.0005 ~ 0.5 uF

CSI-0200

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